MAXIM INTEGRATED PRODUCTS MAX7318AUG+ I/O Expander, 16bit, 26 MHz, SPI, 2 V, 5.5 V, TSSOP NiSi NIP-V5-CPL-NC F Mount/FX Format

F Mount/FX Format

The Foam Doughnut is particularly useful for telephoto lens cases that allow a lens to be stored or carried facing downward with or without an attached camera

Detachable Bubble Level

It's also wide enough to accommodate bulkier items such as a power brick

MAXIM INTEGRATED PRODUCTS MAX7318AUG+ I/O Expander, 16bit, 26 MHz, SPI, 2 V, 5.5 V, TSSOP NiSi NIP-V5-CPL-NC F Mount/FX FormatProduct details No. of I O's 16I O's Chip Configuration 16bit Bus Frequency 26MHz No. of Pins 24Pins Product Range Automotive Qualification Standard Interface Case Style TSSOP Supply Voltage Min 2V IC Interface Type SPI Packaging Each Supply Voltage Max 5. 5V MSL MSL 1 Unlimited Other details Brand MAXIM INTEGRATED PRODUCTS Part Number MAX7318AUG+ Quantity Each Technical Data Sheet EN All product and company names are trademarks or registered